Chapter 17 - St. Louis Scholarship

Application details:

Amount:

$1000

Application deadline:

19 Jul 2023

Description:

Applicant must be a student enrolled in a manufacturing engineering, industrial technology, or other related program. First preference will be given to applicants who reside within the boundaries of St. Lewis Chapter 17. Second preference will be given to applicants who reside within the state of Missouri. A minimum 2.5 GPA is required.

Enrollment level:

College senior, College sophomore, College junior, College freshman
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